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Graphic etching etching-ICP

ICP Etching machine Oxford Instrument PlasmaPro System100 ICP 180

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It is mainly used for uniform etching of SiO, SiN and Si with diameters of 6 and below, so as to realize micro nano structure processing. The equipment has the characteristics of good stability, high repeatability and good compatibility. Compatible with a variety of etching processes. It can be widely used in semiconductor materials, optoelectronics, integrated circuits, laser optics, infrared detectors, power devices, MEMS systems and other processing and related research.

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