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RCA standard cleaning

Chemical cleaning of silicon wafers. Remove surface organics contamination, oxide film, particles and metal contamination.

The maximum support is 6 inches.


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The service is introduced:

Chemical cleaning of silicon wafers. Remove surface organics contamination, oxide film, particles and metal contamination.

The maximum support is 6 inches.


The service content:

1. The SPM (- H2SO4: H2O2) cleaning

2. HF (DHF) cleaning

3. APM(sc-1: NH4OH /H2O2 /H2O) cleaning.

4. HPM(sc-2 :HCl /H2O2 /H2O) cleaning.

5. Heat N2 blow-dry

6. Optical detection


Service description:

Customer needs to provide: substrate and cleaning requirements, each step can be specified separately.


Experimental period: 1-2 working days. It depends on how easy it is.


Fee standard: xx yuan/piece; Special pieces will be negotiated separately.


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