Home - Technology - Single step process

Reactive Ion Etching

The substrate material is etched by reactive ion etching (RIE). Mainly for etching SiO and sines.

The device model is Oxford PlasmaPro 100 RIE, with the maximum support of 6 inches.


Contact us

The service is introduced:

The substrate material is etched by reactive ion etching (RIE). Mainly for etching SiO and sines.

The device model is Oxford PlasmaPro 100 RIE, with the maximum support of 6 inches.


The service content:

1. Reactive ion etching basement.

2. Removal of photoresist (optional)

3. Optical detection


Service description:

Customer needs to provide: substrate. Provide mask graphics information (photoresist/media/metal etc.).

Experimental period: 1-2 working days.

Fee standard: xx yuan/piece; Special pieces will be negotiated separately.


Results show: